Improving the durability of superconductors with optimized solder joints
Professor Mingzhi Guan's team used computer modelling to show that shorter solder joints with thinner solder reduce stress at joint edges in superconducting tapes, lowering the risk of early failure.
Read the original paper
Researchers from the institute of Modern Physics, Chinese Academy of Sciences and Huizhou University have made a significant breakthrough in understanding how high temperature superconducting (HTS) materials perform when connected through soldering. These HTS materials, known as rare earth-barium-copper-oxide coated conductors, can carry large amounts of electrical current with minimal energy loss, even in strong magnetic fields. However, for large-scale projects like power cables or scientific equipment, multiple pieces of this material need to be soldered together. This study, published in the journal Materials, investigates how these soldered joints hold up under electromechanical properties and mechanical behaviors.
The team, led by Professor Mingzhi Guan in collaboration with Tianfa Liao, Dr. Wenyuan Wang, and Dr. Zhiming Chen explored how the length of the solder joint and the thickness of the solder material affect its strength and performance. “Understanding how these joints behave is crucial for making superconductors more durable and efficient in practical applications,” said Professor Guan.
To conduct their study, the researchers used a detailed computer model that simulates how these joints perform in real-world situations. This model helped them analyze how different layers of the rare earth-barium-copper-oxide material and the solder respond to stress. It showed that using a shorter joint with thinner solder made the connection more robust by reducing stress in the areas where damage typically starts. “One of our key findings is that shorter joints with less solder can help prevent early failures,” explained Professor Guan.
The study identified that the edges of the solder joints are especially vulnerable. Stress tends to concentrate at these points, making them more likely to crack or break. By shortening the overlap and using thinner solder, the researchers found that the stress is more evenly spread, reducing the risk of early damage. This is important because when the joint is under too much stress, it loses its ability to carry as much electrical current, a critical factor for superconducting materials.
The researchers also compared two common ways of making these joints: face-to-face and back-to-back. While the face-to-face method is often preferred because it reduces electrical resistance, the back-to-back configuration proved stronger in handling physical stress. Although the face-to-face approach makes the joint better at conducting electricity, the back-to-back method might increase its durability. “This opens up new possibilities for designing superconducting devices that are both efficient and longer-lasting,” said Professor Guan.
These findings have practical implications for industries using superconductors in advanced technologies. Rare earth-barium-copper-oxide coated conductors are increasingly being used in applications like magnetic energy storage, MRI machines, and high-powered cables, which all require long lengths of material. Since the tapes used for these superconductors aren’t long enough on their own, they need to be soldered together, which can create weak spots. “Our research provides a guide for designing stronger, more reliable joints, which could extend the lifespan of superconducting devices,” Professor Guan added.
In conclusion, Professor Guan and colleagues’ research offers a method for predicting how these joints will perform under real-world conditions. The results suggest that by using shorter joints, thinner solder, and considering the back-to-back method, the reliability and performance of superconducting systems can be greatly improved. This study represents a key step in making high-temperature superconductors more practical for widespread use in various industries that rely on cutting-edge technology.
About the researcher
Journal reference
Liao, T., Wang, W., Chen, Z., & Guan, M. (2024). “Numerical Study on Mechanical Behavior and Electromechanical Properties of Solder-Jointed REBCO-Coated Conductors.” Materials, 17(2517). DOI: https://doi.org/10.3390/ma17112517



